· Manage the development of assembly and packaging solutions for advanced ICs
· Be responsible for development of IC assembly solution for end customers
· Manage and audit worldwide assembly vendors
· Conduct assembly quality assurance.
· You hold a B.Sc in Electrical or Material Engineering and similar
You have at least 5 years of experience in IC packaging.
· You have incredible professional knowledge in advanced assembly technologies, lead frame and substrate based packages, chip scale packages, chip-on-board technologies.
איזור: גוש דן