Packaging Expert

מס' משרה: 203091

גוש דן

תחום: חומרה


·      Manage the development of assembly and packaging solutions for advanced ICs
·      Be responsible for development of IC assembly solution for end customers
·      Manage and audit worldwide assembly vendors
·      Conduct assembly quality assurance. 


·      You hold a B.Sc in Electrical or Material Engineering and similar
You have at least 5 years of experience in IC packaging.
·      You have incredible professional knowledge in advanced assembly technologies, lead frame and substrate based packages, chip scale packages, chip-on-board technologies.

איזור: גוש דן

תחום: חומרה


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